•Patented Tri-Layer Beam Structure
–Improved process yield through reduced residual stress effect
–Improved temperature tolerance through balanced beam structure
–Simplified implementation design by separating DC and RF signal paths
•Patented Flat Beam Structure
–Reduced friction caused by non-flat beam structure
–Improved fundamental switch operation
•Patented Electrode Head Design
–Improved long-term device reliability
–Improved fabrication process yield
