RF MEMS for the next generation
communication systems
PATENTS

Chia-Shing Chou, A Fabrication Method for Making a Planar Cantilever, Low Surface Leakage, Reproducible and Reliable Metal Dimple Contact Micro-Relay MEMS Switch, US Patent number: 6,962,832. 11/08/2005

Chia-Shing Chou, Microelectomechanical device having a common ground plane layer and a set of contact teeth and method for making the same, US Patent number: 7,101,724. 09/05/2006

Chia-Shing Chou, A Planarized Structure for a Reliable Metal-to-Metal Contact Micro-Relay MEMS Switch, US Patent number: 7,230,513. 06/12/200

Chia-Shing Chou, “A Head Electrode Region for a Reliable Metal-to-Metal Contact Micro-Relay MEMS Switch”, US Patent 7352266, issued April 1, 2008.

Chia-Shing Chou, “A Balanced MEMS Switch for the Next Generation Communication Systems”, U.S. Patent pending.